9 - 11 June 2026
Nuremberg
Hall:4－231
Booth visual・MAP (Hall:4-231)
Exhibit Topix
▶Silicon Nitride Ceramics : Pattern Circuit Substrates
This product is an insulation and heat dissipation substrate with copper circuit for mounting semiconductor chips in the power module.
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▶Silicon Nitride Ceramics: Plain Substrates
This product is an insulation and heat dissipation substrate for semiconductor products. It boasts reliable insulation properties even with thin thickness. |
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